This paper introduces an approach of using a plated through-hole (PTH) via transmission-line model in the design of a thick printed circuit board, such as a backpanel. Full wave FEM modeling of a section of backpanel containing a differential via pair was compared with a transmission model. Computed values of the differential transmission loss agreed within an acceptable range for engineering studies, yet the transmission line model results required less than 2% of the computation time that the full wave model required. Effects of via spacing, via diameter and trace thickness were also examined.

Meeting Name

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging (2005: Oct. 24-26, Austin, TX)


Electrical and Computer Engineering

Keywords and Phrases

Circuit Simulation; Differential Transmission Loss; Differential Via Pair; Finite Element Analysis; Full Wave FEM Modeling; Plated Through-Hole Via Design; Printed Circuit Board; Printed Circuit Design; Trace Thickness; Transmission Line Models; Transmission Lines; Via Diameter; Via Spacing

International Standard Book Number (ISBN)


Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2005 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Oct 2005