Abstract
A low-cost, wideband printed circuit boards (PCBs) manufactured antenna is proposed in this letter for 5G/6G antenna-in-package (AiP) applications with wideband common-mode current (surface-wave) choking characteristics. The antenna is based on a grounded, wideband, high-efficiency electromagnetic structure (WHEMS) and a backing cavity, in which a radiating choke is introduced. By changing the choking condition of a quarter-wavelength, widely applied in traditional low-frequency baluns, wideband common-mode current suppression is achieved. The enclosing wall of the backing cavity is realized by a combination of isolated grounded vias and connected grounded vias based on current polarization on the wall. Finally, a 22% impedance bandwidth (60-75 GHz) and a relative gain of 8-10 dBi within the band is achieved.
Recommended Citation
L. Chi et al., "A 60 GHz PCB Wideband Antenna-in-Package for 5G/6G Applications," IEEE Antennas and Wireless Propagation Letters, vol. 19, no. 11, pp. 1968 - 1972, article no. 9133305, Institute of Electrical and Electronics Engineers, Nov 2020.
The definitive version is available at https://doi.org/10.1109/LAWP.2020.3006873
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
5G; 6G; antenna-in-package (AiP); common-mode current; printed circuit boards (PCBs); surface wave
International Standard Serial Number (ISSN)
1548-5757; 1536-1225
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Nov 2020
Comments
National Natural Science Foundation of China, Grant MCM 20150101