Abstract
Crosstalk among vias is a significant problem in high-speed multilayer printed circuit boards (PCBs), deteriorating signal quality and increasing jitter, especially when circuit density is high. in this paper, a two-step via crosstalk evaluation procedure is proposed. a fast approach for crosstalk estimation is developed for net screening as the first step. Then, more accurate but more time-consuming modeling can be performed for critical nets or the problematic nets identified in the screening. the main contribution of this study includes the analytical prediction of crosstalk among vias based on an infinite parallel-plane assumption. its effectiveness and efficiency to predict the trends in the crosstalk among vias in practical PCB designs are demonstrated. © 2012 IEEE.
Recommended Citation
S. Wu and J. Fan, "Analytical Prediction of Crosstalk among Vias in Multilayer Printed Circuit Boards," IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 2, pp. 413 - 420, article no. 6132414, Institute of Electrical and Electronics Engineers, Apr 2012.
The definitive version is available at https://doi.org/10.1109/TEMC.2011.2179658
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Physics-based via circuit model; printed circuit board (PCB); signal integrity; via crosstalk; via models
International Standard Serial Number (ISSN)
0018-9375
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Apr 2012
Comments
National Science Foundation, Grant 0855878