Electrodeposition of Copper on Plasma and Thermally Oxidized Titanium Substrates

Abstract

The effect of plasma and thermal oxidation of titanium cathode blanks on copper electrodeposition was studied. Polarization, potential and current step experiments were performed to evaluate electrochemical changes caused by the oxidation treatments. Scanning electron microscopy, Auger electron spectroscopy and X-ray diffraction were used to characterize the titanium substrates and the deposited copper films. Particular emphasis was given to the initial stages of copper nucleation and growth. The results showed that copper electrocrystallization was strongly influenced by the condition of the oxidized titanium surface. High density, uniform copper coverage was found on titanium substrates oxidized at 400 and 500°C for 3 h under plasma or low oxygen pressure (80 mTorr) environments. The copper nucleation density and uniformity decreased considerably on titanium surfaces oxidized at 100 and 200°C. Attempts were made to identify changes in the mechanism of copper nucleation on the oxidized titanium substrates using models developed by Thirsk and Harrison (A Guide to the Study of Kinetics, Academic, New York, 1972, p. 115). © 1997 Elsevier Science S.A.

Department(s)

Electrical and Computer Engineering

Second Department

Materials Science and Engineering

Keywords and Phrases

Electrocrystallization; Nucleation; Overpotential; Polarization

International Standard Serial Number (ISSN)

0257-8972

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Elsevier, All rights reserved.

Publication Date

01 Mar 1997

Link to Full Text

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