An Ultrawideband Electric Probe based on U-Shaped Structure for Near-Field Measurement from 9 KHz to 40 GHz
Abstract
A normal electric probe with miniature size and ultrawideband characteristic is proposed in this letter. The probe is fabricated in a four-layer printed circuit board (PCB) with a high-performance dielectric RO4003C and RO4450. The minimum width of the probe is 4 mm, and the length of probe is 48 mm. The probe can be used in compact and complex space like PCB and integrated circuit. The designs of U-shaped structure and tuning element matrix are used to expand the work band and optimize the impedance of signal via. The work band of probe can cover from 9 kHz to 40 GHz. It can improve the test efficiency in ultrawideband application compared with series probe. The sensitivity of the probe is higher about 12 dB than commercial probe above 1 GHz, and the spatial resolution is 1 mm when the height of probe is 0.3 mm. The proposed probe is verified with simulation in full-wave tool and measurement.
Recommended Citation
W. Liu et al., "An Ultrawideband Electric Probe based on U-Shaped Structure for Near-Field Measurement from 9 KHz to 40 GHz," IEEE Antennas and Wireless Propagation Letters, vol. 18, no. 6, pp. 1283 - 1287, Institute of Electrical and Electronics Engineers (IEEE), Jun 2019.
The definitive version is available at https://doi.org/10.1109/LAWP.2019.2915258
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Impedance Matching; Miniature; Near-Field Measurement; U-Shaped Structure; Ultrawideband Probe
International Standard Serial Number (ISSN)
1536-1225
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jun 2019
Comments
This work was supported in part by the National Natural Science Foundation of China under Grant 61427803 and Grant 61271044, and in part by the Defense Industrial Technology Development Program under Grant JCKY2016601B005.