A High-Sensitivity Resonant Tangential E-Probe with Loaded Improved Dipole and Embedded Integrated Balun
In this paper, a high-sensitivity resonant probe for capturing tangential E -field component is fabricated on a four-layer printed circuit board. The resonant probe consists of an improved dipole employed to further enhance sensitivity, a resonator made up of open- and short-circuit stubs achieving specific resonance, and an integrated Marchand balun used to transform the differential-mode voltage to the single-end output and match the instrument port impedance match. Compared with the referenced broadband probe, the relative sensitivity of the proposed resonant probe in terms of |S12| is enhanced by 13.21 and 14.82 dB for simulation and measurement, respectively. The absolute sensitivity in terms of the noise-equivalent field strength (NEFS) is 26.4 dBµV(Hz)1/2 . The measurements of the passive circuits (microstrip lines and coupled lines) and active circuit module are conducted to validate the resonant probe.
J. Wang et al., "A High-Sensitivity Resonant Tangential E-Probe with Loaded Improved Dipole and Embedded Integrated Balun," IEEE Transactions on Instrumentation and Measurement, vol. 68, no. 8, pp. 3042-3044, Institute of Electrical and Electronics Engineers (IEEE), Aug 2019.
The definitive version is available at https://doi.org/10.1109/TIM.2019.2920700
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
E-Field Probe; Electromagnetic Compatibility (EMC); High Sensitivity; Marchand Balun; Noise-Equivalent Field Strength (NEFS); Resonant Tangential
International Standard Serial Number (ISSN)
Article - Journal
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Aug 2019