Glass-Interposer Electromagnetic Bandgap Structure with Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling
In this paper, we propose glass-interposer (GI) electromagnetic bandgap (EBG) structure with defected ground plane (DGP) for efficient and broadband suppression of power/ground noise coupling. We designed, fabricated, measured, and analyzed a GI-EBG structure with DGP for the first time. The proposed GI-EBG structure with DGP is thoroughly analyzed using the dispersion characteristics and estimated stopband edges, f L and f U . We experimentally verified that the proposed GI-EBG structure with DGP achieved power/ground noise isolation bandgap (below-30 dB) between f L of 5.7 GHz and f U of 11 GHz. Estimation of f L and f U using dispersion analysis, full 3-D electromagnetic (EM) simulation results, and measurement results achieved good correlation. Effectiveness of the proposed GI-EBG structure with DGP on suppression of the power/ground noise coupling to high-speed through glass via (TGV) channel is verified with 3-D EM simulation. As a result, the proposed EBG structure successfully and efficiently suppressed the power/ground noise coupling and improved the eye diagram of the TGV channel. Lastly, we embedded thin alumina film in the proposed EBG structure and achieved even broader power/ground noise suppression between 2.1 and 14.7 GHz.
Y. Kim et al., "Glass-Interposer Electromagnetic Bandgap Structure with Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 9, pp. 1493-1505, Institute of Electrical and Electronics Engineers (IEEE), Sep 2017.
The definitive version is available at https://doi.org/10.1109/TCPMT.2017.2730853
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Defected ground plane (DGP); electromagnetic bandgap (EBG); glass; interposer; power/ground noise; through glass via (TGV)
International Standard Serial Number (ISSN)
Article - Journal
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Sep 2017