Probing Nanostrain via a Mechanically Designed Optical Fiber Interferometer


We propose an extrinsic Fabry-Perot interferometer (EFPI)-based optical fiber sensor with a novel mechanical design for nano-scale strain measurement. In our proposed sensor, a designed mechanical structure consists of a cylinder and a square column attached to a stainless steel substrate. This simple and compact structure along with a fiber ceramic ferrule and a gold-coated reflective mirror as a packaged EFPI sensor can resolve nano-scale strain with temperature self-compensation. In comparison with the existing nanostrain sensing methods, no reference sensors and complicated configurations are needed. The strain measured by our proposed sensor ranges from 0 to 677 nε with a measurement accuracy of ±5 nε. This robust and easy-to-build geometry-based nano-scale strain sensor has great potential in nanotechnology, geophysical research, seismic monitoring, and other practical applications.


Electrical and Computer Engineering


University of Missouri Research Board
Missouri University of Science and Technology. Materials Research Center
Missouri University of Science and Technology. Intelligent Systems Center


This work was supported in part by the University of Missouri Research Board, in part by the Materials Research Center at Missouri S&T, and in part by the ISC Center Post-Doc Matching Funds at Missouri S&T.

Keywords and Phrases

Capacitive sensors; Cavity resonators; Composite structures; Fabry-Perot interferometers; Fiber optic sensors; Fiber optics; Fibers; Gold coatings; Interferometers; Nanotechnology; Optical fibers; Stainless steel; Strain; Strain measurement; Temperature measurement; Extrinsic Fabry Perot interferometer; Geophysical researches; mechanical; Nanostrain; Optical fiber interferometers; Stainless steel substrates; Strain sensors; Temperature self-compensation; Nanosensors; Extrinsic Fabry-Perot interferometer; Mechanical

International Standard Serial Number (ISSN)

1041-1135; 1941-0174

Document Type

Article - Journal

Document Version


File Type





© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2017