Application of Frequency Selective Surfaces for Inspection of Layered Structures
Structural health monitoring is important to many industries today. In the case of layered structures (such as composite structures found in the infrastructure and aerospace industries), one failure mechanism that is important to detect is that of delaminations. Numerous nondestructive testing (NDT) methods have been developed for this purpose including acoustic, thermography, microwave, etc. This paper presents a new application of frequency selective surfaces (FSS's) as a potential inspection method for detection of delaminations in layered structures. Simulations and measurements are presented that support the potential of this method to serve as an additional NDT technique for layered structures. The results indicate that FSS's are sensitive to delaminations occurring in the local vicinity of the FSS, but are less sensitive to delaminations occurring at other layer interfaces.
D. F. Pieper and K. M. Donnell, "Application of Frequency Selective Surfaces for Inspection of Layered Structures," Proceedings of the 2015 IEEE International Instrumentation and Measurement Technology Conference (2015, Pisa, Italy), vol. 2015-July, pp. 1204-1209, Institute of Electrical and Electronics Engineers (IEEE), May 2015.
The definitive version is available at https://doi.org/10.1109/I2MTC.2015.7151444
2015 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2015 (2015: May 11-14, Pisa, Italy)
Electrical and Computer Engineering
Keywords and Phrases
Aerospace industry; Composite materials; Delamination; Failure (mechanical); Frequency selective surfaces; Materials testing; Metamaterials; Microwave acoustics; Structural health monitoring, Failure mechanism; Inspection methods; Layer interfaces; Layered Structures; New applications; Remote monitoring; Simulations and measurements; Spatial filters, Nondestructive examination; Nondestructive testing
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2015 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 May 2015