Adaptive Multi-Path BCH Decoder to Alleviate Hotspot-Induced DRAM Bit Error Variation in 3D Heterogeneous Processor
A 3D heterogeneous processor (commonly termed as 3DHP) integrates multiple processor (such as CPU/GPU) and DRAM dies, interconnected vertically by a massive number of Through-Silicon Vias (TSVs). The 3DHP is expected to address the limited bandwidth, high latency and energy consumption of off-chip DRAM. However, spatial and temporal variability due to hotspots in on-chip thermal gradient may result in wide bit error variation in DRAM dies. This work proposes a novel adaptive multi-path BCH decoder to efficiently address this issue. Instead of having a static BCH decoder designed from the worst-case bit error probability analysis, the proposed adaptive multi-path BCH decoder offers multiple decoding paths with varying target number of error bits to correct, which is estimated from the thermal gradient data generated by on-chip temperature sensors. Thus, it minimizes the overall decoding latency adaptively. The proposed approach has been verified by implementing an adaptive 4-path BCH decoder in FPGA hardware. A series of decoding performance evaluation data has been generated to demonstrate the efficiency of the proposed design.
P. Metku et al., "Adaptive Multi-Path BCH Decoder to Alleviate Hotspot-Induced DRAM Bit Error Variation in 3D Heterogeneous Processor," Journal of Semiconductor Technology and Science, vol. 17, no. 5, pp. 717 - 728, Institute of Electronics Engineers of Korea, Oct 2017.
The definitive version is available at https://doi.org/10.5573/JSTS.2017.17.5.717
Electrical and Computer Engineering
National Science Foundation (U.S.)
Keywords and Phrases
Decoding; Electronics Packaging; Energy Utilization; Errors; Thermal Gradients; Three Dimensional Integrated Circuits; BCH Decoder; Bit Error Probability Analysis; Decoding Performance; Heterogeneous Processors; Multiple Decoding Paths; Spatial and Temporal Variability; Thermal Integrity; Through Silicon Vias; Bit Error Rate; 3D Heterogeneous Processor; Bit Error Rate Variability
International Standard Serial Number (ISSN)
Article - Journal
© 2017 Institute of Electronics Engineers of Korea, All rights reserved.
01 Oct 2017