Recent Enhancements to the SmartBrick Structural Health Monitoring Platform


This paper introduces several new developments in the SmartBrick structural health monitoring platform. The system, which has been described in previous papers, provides an extremely low-power, long-term method for remote structural health monitoring. The system is capable of monitoring a diverse range of environmental and structural phenomena, including strain, vibration, tilt, and temperature; and communicating the collected data and any alerts over the GSM cellular infrastructure. The system is completely autonomous and wireless, requiring only its self-contained power and GSM network coverage to operate unattended for five or more years. The emphasis of this paper is on advances made in the third generation of the SmartBrick platform. Highlights include the development of a web interface that facilitates retrieval and visualization of data and remote maintenance and calibration of the system, and additional enhancements made to support dynamic structural monitoring. The paper also includes a survey of recent wireless SHM systems, and a comparison of these solutions with the SmartBrick platform.

Meeting Name

12th International IEEE Conference on Intelligent Transportation Systems (2009: Oct. 4-7, St. Louis, MO)


Electrical and Computer Engineering


United States. Department of Transportation
Missouri University of Science and Technology. Intelligent Systems Center
Seventh Framework Programme (European Commission). Program on Smart Monitoring of Historic Structures

Keywords and Phrases

Cellular Infrastructure; Diverse Range; GSM Networks; Low Power; Remote Maintenance; Structural Health; Structural Monitoring; Third Generation; Web Interface; Data Visualization; Health; Intelligent Vehicle Highway Systems; Monitoring; Structures (Built Objects); Vehicle Locating Systems; Wireless Networks; Structural Health Monitoring

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)

2153-0009; 2153-0017

Document Type

Article - Conference proceedings

Document Version


File Type





© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Oct 2009