Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions

Author

Xin Chang
Bruce Archambeault, Missouri University of Science and TechnologyFollow
Matteo Cocchini
Francesco de Paulis
Vysakh Sivarajan
Yaojiang Zhang, Missouri University of Science and TechnologyFollow
Jun Fan, Missouri University of Science and TechnologyFollow
Samuel R. Connor
Antonio Orlandi
James L. Drewniak, Missouri University of Science and TechnologyFollow

Abstract

This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.

Recommended Citation

X. Chang and B. Archambeault and M. Cocchini and F. de Paulis and V. Sivarajan and Y. Zhang and J. Fan and S. R. Connor and A. Orlandi and J. L. Drewniak, "Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008, Hamburg, Germany), Institute of Electrical and Electronics Engineers (IEEE), Sep 2008.

The definitive version is available at https://doi.org/10.1109/EMCEUROPE.2008.4786874

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008: Sep. 8-12, Hamburg, Germany)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Cavity Effects; Cavity Resonance; EMI; Reference Planes; Return Currents; Signal Integrity; Via; Cavity Resonators; Electric Inverters; Electromagnetic Pulse; Plastic Molds; Resonance; Signal Processing; Electromagnetic Compatibility; Bandwidth; Electromagnetic Interference; Impedance; Dielectric Losses; Equivalent Circuits; Signal Analysis; Analytical Models; Circuit Simulation; Capacitors; Integrated Circuit Interconnections; Return Via Connections; Signal Link Path Bandwidth; Via Transitions; Return Current; Equivalent Circuit

International Standard Book Number (ISBN)

978-1424427376

International Standard Serial Number (ISSN)

2325-0356; 2325-0364

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Sep 2008