Modeling Broadside Coupled Traces using Equivalent Per Unit Length (eq PUL) RLGC Model


Increases in printed circuit board (PCB) cost is leading to denser routing of high speed signal traces and this, in turn, is increasing the crosstalk among the traces. The crosstalk between the broadside coupled traces in adjacent layers is becoming an important factor to account for as the signal speeds increase. The coupling between parallel broadside coupled traces can be modeled using multi-conductor transmission line theory based on telegrapher equations using equivalent per-unit-length (Eq PUL) resistance, inductance, capacitance, and conductance (RLCG) matrices. The same approach is not applicable for the traces crossing at an arbitrary angle. A fast methodology to develop Eq PUL RLGC models that captures the coupling physics of broadside coupled traces crossing at an angle based on geometrical parameters of the stackup, and the dielectric material properties is proposed based on the idea presented in [1]. In this paper, validation of these equivalent models is done by estimating the crosstalk impact on eye opening at a specified bit error rate (BER) at different signal speeds and results are compared against full wave models.

Meeting Name

21st Conference on Electrical Performance of Electronic Packaging and Systems (2012: Oct. 21-24, Tempe, AZ)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Adjacent Layers; Arbitrary Angles; Broadside Coupled; Coupling Physics; Equivalent Model; Eye Openings; Full-Wave Model; High-Speed Signals; Multiconductor Transmission Line Theory; Per Unit Length; Per-Unit-Length(PUL) RLGC; Printed Circuit Boards (PCB); Signal Speed; Telegrapher Equation; Dielectric Materials; Electronics Packaging; Crosstalk

International Standard Book Number (ISBN)

978-1467325394; 978-1467325387

Document Type

Article - Conference proceedings

Document Version


File Type





© 2012 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Oct 2012