Powered System-level Conductive TLP Probing Method for ESD/EMI Hard Fail and Soft Fail Threshold Evaluation

Abstract

In this paper an advanced system-level TLP probing technique is presented to evaluate the ESD and EMI performance of a powered system applicable to high speed interfaces. It allows to detect hardware and software fail thresholds to assess the performance of an ESD/EMI protection solution. The method is demonstrated on a Intel mobile phone reference platform.

Meeting Name

35th Electrical Overstress/Electrostatic Discharge Symposium (2013: Sep. 10-12, Las Vegas, NV)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Hardware and Software; High-speed Interfaces; Probing Techniques; System Levels

International Standard Book Number (ISBN)

978-1-58537-232-4

International Standard Serial Number (ISSN)

0739-5159

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2013 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Sep 2013

Link to Full Text

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