Sensitivity Analysis of a Circuit Model for Power Distribution Network in a Multilayered Printed Circuit Board
Power distribution network (PDN) design in high speed digital systems is a critical challenge for system performance. Common design methodologies refer to guidelines and engineering best practices while using simulations to evaluate the design. If the relation between the design choices and the performance parameters is known, the engineering is simpler. A lumped circuit model that relates physics and design geometry was proposed in an earlier study for modeling practical printed circuit board (PCB) PDN designs. In this paper, the lumped circuit model proposed earlier is used to develop a well-defined relation between the design geometry, the model elements, and the PDN impedance response features. The PDN impedance is simplified and broken down into common features for all PCB PDNs. These features are mapped to the model elements using sensitivity analysis and consequently to design geometry. The physics behind the relation between the response and geometry is reinforced with the current paths in different frequency ranges and generalized to common PDN designs on multilayer PCBs that use area fills for the power net.
K. Shringarpure et al., "Sensitivity Analysis of a Circuit Model for Power Distribution Network in a Multilayered Printed Circuit Board," IEEE Transactions on Electromagnetic Compatibility, vol. 59, no. 6, pp. 1993-2001, Institute of Electrical and Electronics Engineers (IEEE), Dec 2017.
The definitive version is available at https://doi.org/10.1109/TEMC.2017.2673851
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
National Science Foundation (U.S.)
Keywords and Phrases
Analytical Models; Capacitors; Circuit Simulation; Circuit Theory; Electric Impedance; Electric Network Analysis; Geometry; Lumped Parameter Networks; Printed Circuit Design; Sensitivity Analysis; Timing Circuits; Engineering Best Practice; High-Speed Digital Systems; Integrated Circuit Modeling; Multi-Layered Printed Circuit Boards; Performance Parameters; Power Distribution Network; Power Integrity; Printed Circuit Boards (PCB); Modeling PCB PDN; Power Distribution Network (PDN); Power Integrity; Printed Circuit Board (PCB)
International Standard Serial Number (ISSN)
Article - Journal
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Dec 2017