Quantifying High-Density Connector Radiation in a Lossy Multisignal Environment


A method is presented to quantify the radiated power from a high-density connector. This method is based on network parameters and the principle of conservation of power. Unlike previous work, which assumed only radiated losses were present, the proposed method is able to characterize the radiated power in environments that contain material losses and when there are multiple signals at the printed circuit board/connector interface. The power losses are quantified through the definition of power loss constant matrices that can be used to find the power losses for arbitrary input excitations when the matrices are entirely known. The power loss constant matrices can be calculated through multiple single-port and two-port excitations for an N-port connector. The formulation of these excitations is dictated by the nonlinear properties of the power loss calculation. Simulations and measurements are presented that validate the proposed power loss calculation methodology.


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Connectors (structural); Electromagnetic waves; Interfaces (materials); Printed circuits; Reconfigurable hardware; Scattering parameters; Arbitrary inputs; Constant matrix; Material loss; Network parameters; Nonlinear properties; Printed circuit boards (PCB); Radiated power; Simulations and measurements; Printed circuit boards; electromagnetic radiation

International Standard Serial Number (ISSN)


Document Type

Article - Journal

Document Version


File Type





© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Feb 2016