Investigation of the Radiated Emissions from High-Speed/High-Density Connectors


Radiation from a complicated connector in the gigahertz range is investigated in this paper. In order to understand the radiation physics of the complex commercial connector, three simplified connector models were built. Simplified structure I was established to understand how the multiple wafers affect the radiation. It is discovered that the produced slot-like antenna structures between wafers can introduce more radiation peaks. For simplified structure II and simplified structure III, they were built to investigate the radiation performances from orphaned differential pair and typical differential pair. It is suggested that additional ground blade for the orphaned differential pair should be introduced to have lower radiation level. Finally, radiations from the typical differential pair for single wafer and multiple wafers are measured. The radiation peaks due to new slot-like antenna structures are observed. The radiations from the orphaned differential pair and typical differential are also measured and compared. Worse radiated emission for the orphaned differential pair within the commercial connector is given and is suggested not to use. Finally, a radiation mitigation method for the high-speed connector is also proposed.


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory


Ministry of Science and Technology (Republic of China)


This work was supported by the National Science Council, Taiwan, under Grant NSC 101-2917-I-002-020.

Keywords and Phrases

Antennas; Slot Antennas; Antenna Structures; Differential Pairs; Gigahertz Range; Mitigation Methods; Radiated Emissions; Radiation Levels; Radiation Performance; Radiation Physics; Radiation; Antenna-Mode Current; Electromagnetic Radiation; High-Speed Connectors

International Standard Serial Number (ISSN)

0018-9375; 1558-187X

Document Type

Article - Journal

Document Version


File Type





© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Feb 2016