EMI Coupling Paths in Silicon Optical Sub-Assembly Package


Optical transceiver modules are commonly used in telecommunication and data communications systems. These modules, which are located in the optical I/O ports at the front-end of switches and routers, are a dominating source of electromagnetic interference (EMI) problems at their operation frequency and/or harmonics. In this study, a simulation model is used to investigate the EMI coupling physics and performance of the silicon optical sub-assembly (OSA) module. Total radiation power (TRP) measurement has also been performed in a mode-stirred reverberation chamber (RC) to support the radiation mechanism analysis. The connector between the module circuit board to flex cable has been identified as the major EMI source above 15 GHz in the OSA module. This conclusion can help provide insight to EMC design engineers about the potential EMI problems in the OSA package.

Meeting Name

2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Electromagnetic pulse; Electromagnetic wave interference; Light transmission; Optical switches; Optical transceivers; Reverberation; Signal interference; Coupling paths; High frequency HF; Mode stirred reverberation chamber; Operation frequency; Optical subassembly; Optical transceiver modules; Radiation mechanism; Total radiated power; Electromagnetic compatibility; electromagnetic interference (EMI); flex PCB

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version


File Type





© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Sep 2016