EMI Coupling Paths in Silicon Optical Sub-Assembly Package
Optical transceiver modules are commonly used in telecommunication and data communications systems. These modules, which are located in the optical I/O ports at the front-end of switches and routers, are a dominating source of electromagnetic interference (EMI) problems at their operation frequency and/or harmonics. In this study, a simulation model is used to investigate the EMI coupling physics and performance of the silicon optical sub-assembly (OSA) module. Total radiation power (TRP) measurement has also been performed in a mode-stirred reverberation chamber (RC) to support the radiation mechanism analysis. The connector between the module circuit board to flex cable has been identified as the major EMI source above 15 GHz in the OSA module. This conclusion can help provide insight to EMC design engineers about the potential EMI problems in the OSA package.
J. Li et al., "EMI Coupling Paths in Silicon Optical Sub-Assembly Package," Proceedings of the 2016 IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada), vol. 2016-September, pp. 890 - 895, Institute of Electrical and Electronics Engineers (IEEE), Sep 2016.
The definitive version is available at https://doi.org/10.1109/ISEMC.2016.7571768
2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Electromagnetic pulse; Electromagnetic wave interference; Light transmission; Optical switches; Optical transceivers; Reverberation; Signal interference; Coupling paths; High frequency HF; Mode stirred reverberation chamber; Operation frequency; Optical subassembly; Optical transceiver modules; Radiation mechanism; Total radiated power; Electromagnetic compatibility; electromagnetic interference (EMI); flex PCB
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Sep 2016