An EMI Estimation for Shielding Edge Treaments on a Printed Circuit Board

Abstract

Various PCB edge treatments including via stitching and edge plating connecting ground planes can be employed to suppress the EMI from multilayer printed circuit boards. The shielding performance of these edge treatments is studied in this work. Design curves and an empirical equation are given based on parametric study to summarize the variation of the total radiated power (TRP) as a function of slot length (spacing between vias) and number of openings. Comparisons between measurements and simulation suitably agree within engineering accuracy.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Sponsor(s)

National Science Foundation (U.S.)

Comments

This material is based upon work supported by the National Science Foundation under Grant No. 0855878.

Keywords and Phrases

Electromagnetic Compatibility; Electromagnetic Shielding; Reconfigurable Hardware; Shielding; Empirical Equations; Multilayer Printed Circuit Board; Parametric Study; Shielding Effectiveness; Shielding Performance; Total Radiated Power; Printed Circuit Boards; Apertures; Edge Platting; EMI; TRP

International Standard Book Number (ISBN)

978-1509014415; 978-1509014422

International Standard Serial Number (ISSN)

2158-1118

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2016

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