The IEC 61967-2 TEM cell standard allows for variations in test parameters which may cause variations in the measured emissions from integrated circuits (ICs). To test the impact of these parameters, two printed circuit boards were designed within the IEC standard using "poor" PCB design strategies and using "good" design strategies. Emissions from three pin-for-pin compatible 8051 microcontrollers were tested. Emissions were measured using both PCBs, changing the PCB configuration, and changing test parameters like the program running on the IC, the rise time of the input clock, and I/O switching. Emissions from the "poor" PCB were about 3-8 dB higher than emissions from the "good" PCB. A change in the program run by the IC, the clock rise-time, and I/O caused a 4-15 dB change in emissions. Emissions differed considerably among the ICs. Possible causes for variations in emissions with the test parameters are discussed.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility, EMC 2008 (2008: Aug. 18-22, Detroit, MI)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

TEM-Cell Method; Emissions; Electromagnetic compatibility; Integrated circuits; Testing

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2008