Characterization of PCBs (Printed Circuit Boards) is usually associated with measurement using a VNA (Vector Network Analyzer) in the frequency-domain or a TDR (Time Domain Reflectometer) in the time-domain. The often used signal launch techniques on PCBs based on the VNA or TDR measurement in the microwave frequency range use SMA or 3.5 mm connectors, in edge-launch or vertical-launch fashions. The signal transition between the launch port and the DUT (Device Under Test) introduces errors in the measurement, which is dominant when compared with a transmission line itself on the PCB as the technologies of PCB manufacturing well developed today. Discontinuities at connector ports depend on the port structures and the dielectric properties of the substrate materials. However, an extended stub at a connector port may significantly influence signal launches, or even corrupt a TRL calibration in a measurement.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2006: Aug. 14-18, Portland, OR)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Port Launch Techniques; TDR Measurement; TRL Deembedding; VNA Measurement; Electric Lines; Frequency Domain Analysis; Measurement Errors; Printed Circuit Boards; Signal Analysis; Electric Connectors; Connectors; Calibration; Frequency Measurement; Transmission Line Measurements; Testing; Dielectric Measurements; Dielectric Substrates; Dielectric Loss Measurement; Time Domain Analysis; Transmission Line Discontinuities

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2006