Signal integrity (SI) analysis of printed circuit boards for high-speed digital design requires information on the perunit-length R, L, G, C parameters of the transmission lines. However, these are not always available when the property of the dielectric medium used in the board is unknown. A method to extract R, L, G, and C parameters from parallel-plate and strip transmission line geometries is proposed. It is based on measured scattering parameters and analytical modeling. A genetic algorithm (GA) is used to optimize the extraction by minimizing the frequency domain discrepancy between an objective function, which is the measured scattering matrix parameter, |S21|, and a GA model based on transmission line theory. The extracted R, L, G, and C parameters are then used in a SPICE model for simulation. Good agreement has been achieved in the reported results.
J. Zhang et al., "Extracting R, L, G, C Parameters of Dispersive Planar Transmission Lines from Measured S-Parameters using a Genetic Algorithm," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2004, Santa Clara, CA), vol. 2, pp. 572-576, Institute of Electrical and Electronics Engineers (IEEE), Aug 2004.
The definitive version is available at https://doi.org/10.1109/ISEMC.2004.1349861
IEEE International Symposium on Electromagnetic Compatibility (2004: Aug. 9-13, Santa Clara, CA)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
S-Matrix Theory; S-Parameters; SPICE; Dielectric Medium; Dispersive Planar Transmission Lines; Distributed Parameter Networks; Frequency Domain; Frequency-Domain Analysis; Genetic Algorithm; Genetic Algorithms; High-Speed Digital Design; Linear Network Analysis; Minimisation; Parallel-Plate Transmission Line; Printed Circuit Boards; Printed Circuit Design; Scattering Matrix Parameter; Scattering Parameters; Signal Integrity Analysis; Strip Lines; Strip Transmission Line; Transmission Line Parameter Extraction; Transmission Line Theory; R,L,G,C Extraction; Signal Integrity; Transmission Line
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Article - Conference proceedings
© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Aug 2004