EMI associated with inter-board connection was studied through common-mode current measurements and FDTD modeling for stacked-card and module-on-backplane configurations. Three types of connections were investigated experimentally including an open pin field connection, an "ideal" semi-rigid coaxial cable connection, and a production connector. Both microstrip and stripline signal routing on the PCB were investigated. The results indicated signal routing on the PCBs or the inter-board connection can dominate the EMI process. Several cases of connector geometries were studied using FDTD modeling and good agreement was achieved between the measured and FDTD results.
X. Ye et al., "EMI Associated with Inter-Board Connection for Module-on-Backplane and Stacked-card Configurations," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (1999, Seattle, WA), vol. 2, pp. 797-802, Institute of Electrical and Electronics Engineers (IEEE), Aug 1999.
The definitive version is available at https://doi.org/10.1109/ISEMC.1999.810121
IEEE International Symposium on Electromagnetic Compatibility (1999: Aug. 2-6, Seattle, WA)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
EMI Associated; FDTD Modeling; PCB; Coaxial Cables; Common-Mode Current Measurements; Connector Geometries; Electric Connectors; Finite Difference Time-Domain Analysis; Inter-Board Connection; Microstrip Lines; Microstrip Signal Routing; Module-On-Backplane Configuration; Open Pin Field Connection; Printed Circuit Accessories; Printed Circuit Layout; Production Connector; Radiofrequency Interference; Semi-Rigid Coaxial Cable Connection; Stacked-Card Configuration; Stripline Signal Routing
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Article - Conference proceedings
© 1999 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Aug 1999