Experimental measurements and numerical modeling were used to study the EMI performance of a module-on-backplane connector for various configurations of signal-return pin-outs. A commercially available open-pin-field connector was used in these results to connect between the mother-board and the daughter-card. The experimental techniques, based on measuring |S21|, included both common-mode current measurements and monopole near-field probe measurements. The FDTD method was used to provide numerical support of the near-field measurements and generally agreed with the measured results for frequencies up to 3 GHz. The FDTD method was also used to investigate the relationship between the radiated EMI at 3 m and the connector pin-out configurations.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2000: Aug. 21-25, Washington, DC)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

3 GHz; EMI Performance; FDTD Study; Common-Mode Current Measurements; Daughter-Card; Electric Connectors; Finite Difference Time-Domain Analysis; Module-On-Backplane Connector; Monopole Near-Field Probe Measurements; Mother-Board; Open-Pin-Field Connector; Radiofrequency Interference; Signal-Return Pin-Outs; Electric Current Measurement; Electromagnetic Wave Interference; Finite Difference Method; Mathematical Models; Time Domain Analysis; Common-Mode Current Measurement; Electric Connectors

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2000 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2000