A method and apparatus form electrical connections between electronic circuits and conductive threads (102, 104, 106, 108) that are interwoven into textile material (130). Electronic circuits (128), such as semiconductor dies, are connected to a carrier (132) and electrical connections (136) are made to conductive connection areas (110, 112, 114, 116) on the carrier (132). Conductive stitching (202, 204, 206, 208) provides electrical contacts for both the conductive connection areas (110, 112, 114, 116) on the carrier (132) and the conductive threads (102, 104, 106, 108) that are interwoven into the textile material (130). Optionally, a thin, flexible substrate material (132) is perforated during the stitching process.
Zollo, J. A., Bachman, B., Beatty, A. R., Bozzpme, S. O., Desai, N. B., Kelley, R. J., & Levy, R. C. (2006). Method and apparatus for solder-less attachment of an electronic device to a textile circuit. U.S. Patents
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11 Apr 2006