Abstract
A method and apparatus form electrical connections between electronic circuits and conductive threads (102, 104, 106, 108) that are interwoven into textile material (130). Electronic circuits (128), such as semiconductor dies, are connected to a carrier (132) and electrical connections (136) are made to conductive connection areas (110, 112, 114, 116) on the carrier (132). Conductive stitching (202, 204, 206, 208) provides electrical contacts for both the conductive connection areas (110, 112, 114, 116) on the carrier (132) and the conductive threads (102, 104, 106, 108) that are interwoven into the textile material (130). Optionally, a thin, flexible substrate material (132) is perforated during the stitching process.
Recommended Citation
Zollo, J. A., Bachman, B., Beatty, A. R., Bozzpme, S. O., Desai, N. B., Kelley, R. J., & Levy, R. C. (2006). Method and apparatus for solder-less attachment of an electronic device to a textile circuit. U.S. Patents
Department(s)
Economics
Patent Application Number
US10/867,345
Patent Number
US7025596B2
Document Type
Patent
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2005 Google Technology Holdings LLC, All rights reserved.
Publication Date
11 Apr 2006
