Doctoral Dissertations


Gang Feng


"The simultaneous switching noise (SSN) in a multilayer power delivery network (PDN) is a critical problem in high-speed printed circuit board (PCB) designs. Full-wave methods are not computationally efficient for analyzing PCB structures normally with a multi-scale nature. In this thesis, a model for multilayer power/ground planes is proposed using basic plane pair blocks derived from the cavity model combined with the segmentation technique. Vias and other circuit elements can further be easily integrated in the multilayer plane model. As a result, the entire PDN model is much more computationally efficient than full-wave methods. Experimental and numerical results have validated the proposed methodology.

As one of the major noise coupling mechanisms in PCB, slots between power plane pair in different layers are often modeled using full-wave methods. In this thesis work, an improved cavity method is developed, which employs the dyadic Green's functions for a PCB cavity and magnetic auxiliary ports with "magnetic voltage" and "magnetic current" definitions. This new method can be applied to slots with arbitrary shapes and has been validated by full-wave simulations.

A new numerical method is proposed to calculate impedance parameters of a irregularly-shaped cavity with either the perfect magnetic conductor (PMC) or the perfect magnetic conductor (PEC) sidewalls. The derived impedance network is particularly suitable for the via structure modeling in high-speed PCBs"--Abstract, page iv.


Fan, Jun, 1971-

Committee Member(s)

Beetner, Daryl G.
DuBroff, Richard E.
Pommerenke, David
OKeefe, Matt
Drewniak, James L.


Electrical and Computer Engineering

Degree Name

Ph. D. in Electrical Engineering


Missouri University of Science and Technology

Publication Date

Fall 2009

Journal article titles appearing in thesis/dissertation

  • Analysis of SSN noise coupling in multilayer power/ground planes with segmentation method and cavity model
  • Extended cavity method to analyze slot coupling between PCB cavities
  • New approach to calculate power plane pair impedance by a boundary integral-equation formulation


xi, 118 pages

Note about bibliography

Includes bibliographical references.


© 2009 Gang Feng, All rights reserved.

Document Type

Dissertation - Open Access

File Type




Subject Headings

Electronic circuits -- Noise
Integrated circuits
Printed circuits

Thesis Number

T 9554

Print OCLC #


Electronic OCLC #


Link to Catalog Record

Electronic access to the full-text of this document is restricted to Missouri S&T users. Otherwise, request this publication directly from Missouri S&T Library or contact your local library.