Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects
In this article, the effects of Cu microstructure on the mechanical properties and extrusion of through-silicon vias (TSVs) were studied based on two types of TSVs with different microstructure. A direct correlation was found between the grain size and the mechanical properties of the vias. Both an analytical model and finite element analysis (FEA) were used to establish the relationship between the mechanical properties and via extrusion. The effect of via/Si interface on extrusion was also studied by FEA. The results suggest small and uniform grains in the Cu vias, as well as stronger interfaces between the via and Si led to smaller via extrusion, and are thus preferable for reduced via extrusion failure and improved TSV reliability.
T. Jiang et al., "Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects," Journal of Microelectronics and Electronic Packaging, vol. 12, no. 3, pp. 118 - 122, International Microelectronics Assembly and Packaging Society (IMAPS), Jul 2015.
The definitive version is available at https://doi.org/10.4071/imaps.456
Civil, Architectural and Environmental Engineering
Keywords and Phrases
Finite element method; Grain size and shape; Interfaces (materials); Mechanical properties; Microstructure; Three dimensional integrated circuits; 3-D interconnects; 3D integration; Extrusion failures; Grain size; Through silicon vias; Extrusion; FEA; Interface; Via extrusion
International Standard Serial Number (ISSN)
Article - Journal
© 2015 International Microelectronics Assembly and Packaging Society (IMAPS), All rights reserved.
01 Jul 2015