Control of CuO Particle Size on SiO₂ by Spin Coating

Author

M. A. Brookshier
Charles C. Chusuei, Missouri University of Science and TechnologyFollow
D. W. Goodman

Abstract

Atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS) were used to study the size and distribution of nanometer-sized metallic particles of four Cu/SiO2 model catalyst systems. The systems were constructed by spin coating copper(II) acetate [Cu(CH3CO2)2·H2O, Cu(ac)2] solutions of varying concentration (0.0040, 0.0070, 0.0085, and 0.010 M) onto polished Si(100) substrates with an 5-10 nm SiO2 oxide overlayer. Homogeneously distributed, nanometer-sized CuO particles were formed by calcinating the samples to 450 °C for 4 h. Narrow particle size distributions were observed for each system, with mean particle size increasing with increasing concentration. The ability to control mean particle size to the order of 1 nm was successfully demonstrated over this concentration range.

Recommended Citation

M. A. Brookshier et al., "Control of CuO Particle Size on SiO₂ by Spin Coating," Langmuir, American Chemical Society (ACS), Jan 1999.

The definitive version is available at https://doi.org/10.1021/la981325k

Department(s)

Chemistry

International Standard Serial Number (ISSN)

0743-7463

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 1999 American Chemical Society (ACS), All rights reserved.

Publication Date

01 Jan 1999