An Electrochemical Method for CuO Thin Film Deposition from Aqueous Solution
An electrochemical procedure is described for the anodic deposition of CuO thin films from solution precursors at 25-30°C in an alkaline medium (pH > 13). The deposition bath was similar to Fehling's solution using tartrate ions as a complexing agent for Cu(II). Cupric oxide deposited onto a platinum substrate at an anodic current density of 5 mA cm-2 has a preferred orientation of . Rietveld refinement of the powder diffraction pattern reveals pure Cu(II) oxide with no trace of other copper oxides. The suggested mechanism involves the irreversible electrochemical oxidation of the tartrate ligand of the Cu(II) complex leading to the CuO precipitation. The same bath can also be used to deposit Cu₂O films using a cathodic electrodeposition process. In this case, cuprous oxide deposited onto a platinum electrode has a  preferred orientation.
P. Poizot et al., "An Electrochemical Method for CuO Thin Film Deposition from Aqueous Solution," Electrochemical and Solid-State Letters, The Electrochemical Society (ECS), Jan 2003.
The definitive version is available at https://doi.org/10.1149/1.1535753
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© 2003 The Electrochemical Society (ECS), All rights reserved.
01 Jan 2003