Abstract
The light ion Engineering Test Facility (ETF) driver concept, based on Hermes III and RHEPP technologies, is a scaled-down version of the LMF design incorporating repetition rate capabilities of up to 10 Hz. The preconceptual design presented here provides 250 TW peak power to the ETF target during 8 ns, equal to 2 MJ total ion beam energy. Linear inductive voltage addition driving a self-magnetically insulated transmission line (MITL) is utilized to generate the 36 MV peak voltage needed for lithium ion beams. The ~3 MA ion current is achieved by utilizing many accelerating modules in parallel. Since the current per module is relatively modest (~300 kA), two-stage or one-stage extraction diodes can be utilized for the generation of singly charged lithium ions. The accelerating modules are arranged symmetrically around the fusion chamber in order to provide uniform irradiation onto the ETF target. In addition, the modules are fired in a programmed sequence in order to generate the optimum power pulse shape onto the target. This design utilizes RHEPP accelerator modules as the principal power source
Recommended Citation
R. E. Olson et al., "The Light Ion Pulsed Power Induction Accelerator for ETF," Digest of Technical Papers, Institute of Electrical and Electronics Engineers (IEEE), Jan 1995.
The definitive version is available at https://doi.org/10.1109/PPC.1995.599826
Department(s)
Physics
Keywords and Phrases
2 MJ; 250 TW; 3 MA; 300 KA; 36 MV; 8 Ns; Engineering Test Facility; RHEPP Accelerator; Accelerating Modules; Fusion Chamber; Inductive Energy Storage; Ion Accelerators; Light Ion Pulsed Power Induction Accelerator; Linear Inductive Voltage Addition; Power Inductors; Power Pulse Shape Optimisation; Power Supplies to Apparatus; Preconceptual Design; Pulse Generators; Pulsed Power Supplies; Pulsed Power Technology; Repetition Rate; Self-Magnetically Insulated Transmission Line
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 1995 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jan 1995