Department
Materials Science and Engineering
Major
Metallurgical Engineering
Research Advisor
O'Keefe, T. J. (Thomas J.)
Advisor's Department
Materials Science and Engineering
Abstract
In order to increase the strength of copper foil bonded to a polymeric substrate material, a dendritic layer is electrodeposited onto the foil. Treating the foil in this manner causes its surface to be rough and porous, thus providing for better penetration of the adhesive and a greater surface area for bonding. The process is particularly helpful in the manufacturing of printed circuit cards, due to the added bond strength which greatly enhances the durability of the printed circuit cards.
Document Type
Report
Presentation Date
29 Jan 1993
Recommended Citation
Lea, Gregory, "Electrochemical Technique for Evaluating Surface Area of a Treated Copper Foil" (1993). Opportunities for Undergraduate Research Experience Program (OURE). 100.
https://scholarsmine.mst.edu/oure/100
