Abstract
Modularized designs have been widely used in today's consumer electronic devices and flexible RF springs are used for electrical connections between the modules. In the meantime, aluminum alloy material becomes a common chassis option. It is well known that the oxidized chassis surface introduces a certain level of nonlinearity when contacted by the springs, as known as passive intermodulation (PIM). PIM is one of the well-known root causes of the RF desensitization (desense). This paper is focused on investigating the relationship between PIM and contact conditions of the springs, especially contact area. The PIM level behavior is explained mathematically by the regrowth rate and the RF power distributions on the contacts. Full-wave simulations and mechanical simulations were conducted to further support the hypothesis.
Recommended Citation
S. Xia and E. Olugbade and Y. He and Y. Wang and H. Wang and K. Rao and M. Poort and H. Zhou and W. Lee and N. McDonnell and J. Park and C. Hwang, "Passive Intermodulation under Different Spring Contact Conditions," 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022, pp. 12 - 16, Institute of Electrical and Electronics Engineers, Jan 2022.
The definitive version is available at https://doi.org/10.1109/EMCSI39492.2022.9889661
Department(s)
Mechanical and Aerospace Engineering
Second Department
Electrical and Computer Engineering
Keywords and Phrases
contact area; contact points; desense; passive intermodulation; radio-frequency interference; spring component
International Standard Book Number (ISBN)
978-166540929-2
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2023 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2022
Included in
Aerospace Engineering Commons, Electrical and Computer Engineering Commons, Mechanical Engineering Commons
Comments
National Science Foundation, Grant IIP-1916535