Abstract
The electrodeposition of copper foil for use in electronic materials applications is a complex and demanding process. The specific aspects of producing and controlling the structure-property-performance requirements of the foil are important because of the stringent demands placed on their use in printed circuit boards and similar products. In this paper, a brief review of the electrodeposition process for raw copper foil is presented. Since electrolyte additives play such a significant role in the copper-deposition process, the effects of two essential additives, chloride ion and an organic (e.g., glue or gelatine), on the foil are described. Also, the influence of other operating parameters on the initial nucleation, growth, and subsequent electro crystallization are discussed. Selected characterization methods, such as polarization and scanning electron micrography techniques, are described as a means of monitoring the process, but universally accepted methods of evaluating and controlling the additives and foil quality during electrolysis are still being sought.
Recommended Citation
Y. K. Lee and T. J. O'Keefe, "Evaluating and Monitoring Nucleation and Growth in Copper Foil," JOM, vol. 54, no. 4, pp. 37 - 41, Springer; Minerals, Metals and Materials Society (TMS), Jan 2002.
The definitive version is available at https://doi.org/10.1007/BF02701655
Department(s)
Materials Science and Engineering
International Standard Serial Number (ISSN)
1047-4838
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Springer; Minerals, Metals and Materials Society (TMS), All rights reserved.
Publication Date
01 Jan 2002
