The Role of Component Packaging in System Electromagnetic Compatibility
This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/1306
There were 1 downloads as of 27 Jun 2016.
Abstract
Increases in the speed and density of electronic systems do not necessarily result in tougher electromagnetic compatibility problems. In fact, recent advances in packaging technology can help designers to meet electromagnetic compatibility requirements. However, working with new technologies requires us to re-evaluate existing EMC design models and guidelines. Understanding the system-level impact of component-level packaging changes, is a prerequisite for meeting stringent electromagnetic compatibility requirements in a timely and cost-effective manner.
This paper has been withdrawn.
