Title

Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions

Abstract

This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008: Sep. 8-12, Hamburg, Germany)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Cavity Effects; Cavity Resonance; EMI; Reference Planes; Return Currents; Signal Integrity; Via; Cavity Resonators; Electric Inverters; Electromagnetic Pulse; Plastic Molds; Resonance; Signal Processing; Electromagnetic Compatibility; Bandwidth; Electromagnetic Interference; Impedance; Dielectric Losses; Equivalent Circuits; Signal Analysis; Analytical Models; Circuit Simulation; Capacitors; Integrated Circuit Interconnections; Return Via Connections; Signal Link Path Bandwidth; Via Transitions; Return Current; Equivalent Circuit

International Standard Book Number (ISBN)

9781424427376

International Standard Serial Number (ISSN)

2325-0356; 2325-0364

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Share

 
COinS