Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions
This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.
X. Chang and B. Archambeault and M. Cocchini and F. de Paulis and V. Sivarajan and Y. Zhang and J. Fan and S. R. Connor and A. Orlandi and J. L. Drewniak, "Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008, Hamburg, Germany), Institute of Electrical and Electronics Engineers (IEEE), Sep 2008.
The definitive version is available at http://dx.doi.org/10.1109/EMCEUROPE.2008.4786874
IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008: Sep. 8-12, Hamburg, Germany)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Cavity Effects; Cavity Resonance; EMI; Reference Planes; Return Currents; Signal Integrity; Via; Cavity Resonators; Electric Inverters; Electromagnetic Pulse; Plastic Molds; Resonance; Signal Processing; Electromagnetic Compatibility; Bandwidth; Electromagnetic Interference; Impedance; Dielectric Losses; Equivalent Circuits; Signal Analysis; Analytical Models; Circuit Simulation; Capacitors; Integrated Circuit Interconnections; Return Via Connections; Signal Link Path Bandwidth; Via Transitions; Return Current; Equivalent Circuit
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Article - Conference proceedings
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