Effect of Anisotropy on Extracted Dielectric Properties of PCB Laminate Dielectrics
The effect of anisotropy of fiber-glass-filled epoxy resin composites, typically used as laminate dielectrics for manufacturing of printed circuit boards (PCB) is studied. It is shown that the extracted dielectric properties, the dielectric constant (Dk) and the dissipation factor (Df), depend significantly on the measurement technique, and first of all, how the electric field in a test fixture or a test vehicle is oriented with respect to the glass fiber bundles in the composite dielectric. The comparison of the dielectric properties obtained using the traveling-wave technique based on the S-parameter measurements and the split-post dielectric resonator technique are shown, and the discrepancy between the results is explained from the point of view of anisotropy and composite mixing theory.
M. Koledintseva et al., "Effect of Anisotropy on Extracted Dielectric Properties of PCB Laminate Dielectrics," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2011, Long Beach, CA), pp. 514-517, Institute of Electrical and Electronics Engineers (IEEE), Aug 2011.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2011.6038366
IEEE International Symposium on Electromagnetic Compatibility (2011: Aug. 14-19, Long Beach, CA)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Composite Dielectrics; Dielectric Resonator Technique; Dissipation Factors; Epoxy Resin Composites; Glass Fiber Bundles; Measurement Techniques; Mixing Theory; S-Parameter Measurements; Test Fixture; Test Vehicle; Traveling Wave; Anisotropy; Dielectric Devices; Dielectric Properties Of Solids; Electric Fields; Electric Properties; Electromagnetic Compatibility; Electromagnetism; Epoxy Resins; Glass Fibers; Microwave Devices; Printed Circuit Boards; Scattering Parameters; Dielectric Materials
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2011 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.