Powered System-level Conductive TLP Probing Method for ESD/EMI Hard Fail and Soft Fail Threshold Evaluation
In this paper an advanced system-level TLP probing technique is presented to evaluate the ESD and EMI performance of a powered system applicable to high speed interfaces. It allows to detect hardware and software fail thresholds to assess the performance of an ESD/EMI protection solution. The method is demonstrated on a Intel mobile phone reference platform.
T. Schwingshackl et al., "Powered System-level Conductive TLP Probing Method for ESD/EMI Hard Fail and Soft Fail Threshold Evaluation," Proceedings of the 35th Electrical Overstress/Electrostatic Discharge Symposium (2013, Las Vegas, NV), Institute of Electrical and Electronics Engineers (IEEE), Sep 2013.
35th Electrical Overstress/Electrostatic Discharge Symposium (2013: Sep. 10-12, Las Vegas, NV)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Hardware and Software; High-speed Interfaces; Probing Techniques; System Levels
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
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