A Systematic Approach to PCB Material Characterization using Time Domain TRL Calibration
Application of the "Thru-Reflect-Line" (TRL) calibration to time domain measurements of S-parameters (t-TRL) allows for significantly increasing an accuracy of the obtained results. However, the accuracy of the t-TRL is still lower than that of the frequency domain vector network analyzers (VNA). There are two main sources of inaccuracies in the t-TRL calibration: random errors, such as an additive noise and jitter, and systematic errors associated with cables, connectors, and port mismatches. The paper addresses these two types of errors by proper selection of the number of sampling points, waveform averages, and record time. The PCB dielectric parameters extraction tool based on TDR/TDT measurements together with the t-TRL calibration has been developed.
V. Khilkevich et al., "A Systematic Approach to PCB Material Characterization using Time Domain TRL Calibration," Proceedings of DesignCon 2010 (2010, Santa Clara, CA), vol. 1, pp. 521-537, Curran Associates, Inc., Feb 2010.
DesignCon 2010 (2010: Feb. 1-4, Santa Clara, CA)
Electrical and Computer Engineering
Article - Conference proceedings
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