Title

Practical Verification of Power Delivery Networks for Smart TV Applications

Abstract

This paper introduces a practical methodology to improve power integrity performance of the chip-package-PCB systems for smart TVs. For power integrity analysis, a chip, package and PCB are modeled as lumped element circuits for simplicity. Case studies are presented to optimize MLCC placement using chip-package-PCB co-simulation under fixed SoC design. In case studies, CPU power net of an application processor is chosen, and voltage droop is measured as a design weight on each physical domains. The introduced methodology is evaluated through experimental verifications.

Meeting Name

2015 IEEE International Conference on Consumer Electronics, ICCE 2015 (2015: Jan. 9-12, Las Vegas, NV)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

AP; Decoupling Capacitor; ODC; ODR; On Co-Simulation; Power Integrity; Power Modeling; Power Noise

International Standard Book Number (ISBN)

978-147997542-6

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2015 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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