Impact of Voltage Bias on Through Silicon Vias (TSV) Depletion and Crosstalk
In this work the circuit segmentation approach for the modeling of Through Silicon Vias (TSV) is extended to the presence of time domain non linear phenomena such as depletion and capacitance hysteresis. Results are shown discussing the impact of the voltage bias on the above mentioned non-linear phenomena and their combined impact on crosstalk among TSV and between TSVs and active circuits.
S. Piersanti et al., "Impact of Voltage Bias on Through Silicon Vias (TSV) Depletion and Crosstalk," Proceedings of the 20th IEEE Workshop on Signal and Power Integrity (2016, Turin, Italy), Institute of Electrical and Electronics Engineers (IEEE), May 2016.
The definitive version is available at http://dx.doi.org/10.1109/SaPIW.2016.7496255
20th IEEE Workshop on Signal and Power Integrity (2016: May 8-11, Turin, Italy)
Electrical and Computer Engineering
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Bias voltage; Capacitance; Crosstalk; Electronics packaging; Hysteresis; Image segmentation; Integrated circuit interconnects; Reconfigurable hardware; Silicon; Active circuits; Circuit segmentation; Modelin; Non-linear phenomena; Nonlinear effect; Through silicon vias; Time domain; Voltage bias; Three dimensional integrated circuits; circuit modelin
International Standard Book Number (ISBN)
Article - Conference proceedings
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