An Efficient Hybrid Boundary-Integral and Finite-Element Method for Signal Integrity Analysis of Multiple Vias Sharing an Anti-Pad in an Infinitely-Large Plate Pair
A domain decomposition approach, namely hybrid boundary-integral and finite-element method, is proposed for signal integrity analysis of an infinitely-large plate pair with multi-vias in a shared anti-pad. Each via structure is modeled as a multi-mode network containing top/bottom transverse electromagnetic (TEM) ports associated with vias and parallel-plate ports a little far away from the anti-pad. Coupling among parallel-plate ports of all via structures is considered by a plate-pair impedance matrix. The connection of the multi-mode networks of via structures and the impedance matrix constructs a complete noise coupling path from one via structure to another one, and the S-parameter of the entire plate pair can be steadily obtained by simply manipulating S-parameter matrices. Numerical examples are used to verify the accuracy of the approach by comparing with a full-wave solver.
Y. Zhang et al., "An Efficient Hybrid Boundary-Integral and Finite-Element Method for Signal Integrity Analysis of Multiple Vias Sharing an Anti-Pad in an Infinitely-Large Plate Pair," IEEE International Symposium on Electromagnetic Compatibility, pp. 224-229, Institute of Electrical and Electronics Engineers (IEEE), Aug 2014.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2014.6898974
2014 IEEE International Symposium on Electromagnetic Compatibility (2014: Aug. 4-8, Raleigh, NC)
Electrical and Computer Engineering
Center for High Performance Computing Research
Keywords and Phrases
Busbars; Domain decomposition methods; Electric impedance measurement; Electromagnetic compatibility; Plates (structural components); Scattering parameters; Boundary integrals; Domain decompositions; Impedance matrices; Multiple vias; Noise coupling; Parallel plates; Signal integrity analysis; Transverse electromagnetic; Finite element method
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.