Title

Accurate Characterization of PCB Transmission Lines for High Speed Interconnect

Abstract

Accurate PCB transmission-line characterization can be challenging due to the effect of test fixtures and launching vias, etc. In this paper, VNA measurements with innovative de-embedding approaches, including those that utilize only one '2X-Thru' calibration standard are studied. The 2X-Thru de-embedding method is first shown to be correlated to existing TRL calibration method. Test boards built with varying lengths of transmission lines routed on different layers were then characterized with the new de-embedding method. Excellent de-embedded results are achieved for frequencies up to 30 GHz.

Meeting Name

Asia-Pacific International Symposium on Electromagnetic Compatibility (2015: May 25-29, Taipei, Taiwan)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Center for High Performance Computing Research

Keywords and Phrases

Calibration; Electromagnetic compatibility; Calibration standard; De-embedding; De-embedding method; Different layers; High speed interconnect; Test fixture; TRL calibration; Electric lines

International Standard Book Number (ISBN)

978-1-4799-6670-7

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2015 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.


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