Attachment of Peptides to Amino-Polystyrene Microspheres
Department
Chemical and Biochemical Engineering
Major
Chemical Engineering
Research Advisor
Forciniti, Daniel
Advisor's Department
Chemical and Biochemical Engineering
Funding Source
Missouri S& T Opportunities for Undergraduate Research Experiences (OURE) Program; NSF Grant 0933468
Abstract
Peptides consisting of leucine with a lysine tail were attached to amino-polystyrene microspheres. The two applications of this project are the development of a sensor for Alzheimer's disease and the observation of peptide interactions in solution. Attachment was confirmed by FTIR. Light scattering measurements show that the latex aggregated during and after derivatization. The most likely cause for the aggregation was hydrophobic interactions between peptides attached to different beads. A possible solution to this problem is to use an alternate surface, such as a silicon wafer.
Biography
Derek is a senior in biochemical engineering from St. Louis, Missouri. He is a member of the Missouri S& T chapters of American Institute of Chemical Engineers, the International Society for Pharmaceutical Engineering, Omega Chi Epsilon Chemical Engineering Honors Society, and Tau Beta Pi Engineering Honors Society.
Research Category
Engineering
Presentation Type
Oral Presentation
Document Type
Presentation
Award
Engineering oral presentation, Second place
Location
Carver Room
Presentation Date
03 Apr 2013, 11:00 am - 11:30 am
Attachment of Peptides to Amino-Polystyrene Microspheres
Carver Room
Peptides consisting of leucine with a lysine tail were attached to amino-polystyrene microspheres. The two applications of this project are the development of a sensor for Alzheimer's disease and the observation of peptide interactions in solution. Attachment was confirmed by FTIR. Light scattering measurements show that the latex aggregated during and after derivatization. The most likely cause for the aggregation was hydrophobic interactions between peptides attached to different beads. A possible solution to this problem is to use an alternate surface, such as a silicon wafer.
