Mechanical and Aerospace Engineering
A solid mechanics model is constructed to discuss the mechanical aspect of a MEM-RF-switch. A thin circular membrane clamped at the perimeter is adhered to a rigid cylindrical flat punch. A tensile load applied to the punch causes an interfacial de lamination. Once the contact circle shrinks to 0.1758 - 0.3651 of the punch dimension depending on the magnitude of the tensile residual stress on the film, a spontaneous delamination, or "pull-off', occurs and the film snaps from the substrate at a critical load and punch displacement. The theoretical model has significant implications in MEMS that involves active moveable films.
Wong, Ming-fung, "Adhesion of an Axisymmetric Film onto a Rigid Substrate: Application to a MEM-RF-switch" (2004). Opportunities for Undergraduate Research Experience Program (OURE). 181.