Experimental and Numerical Studies of Wire Vibrations in Bonded Abrasive Wire Saw Processing
Bonded Abrasive Wire (BAW) saw slicing is a popular method for silicon carbide wafer production; however, the wires are highly susceptible to vibrations. In this paper, a vibration model of the wire saw is presented, and a numerical analysis of this model, which is confirmed by experiments, is developed. The experiments show that the model can predict vibration characteristics of wire saw with no processing or processing and the biggest error of model in frequency domain is 10.6%. Moreover, the wire tension is an important factor for wire saw vibration. The experiments show that a 50% increase in tension may make a 43.2% increase in vibration frequency, and the relationship is not linear depended on tension control device.
A. Tang et al., "Experimental and Numerical Studies of Wire Vibrations in Bonded Abrasive Wire Saw Processing," Proceedings of the 2016 International Symposium on Flexible Automation (2016, Cleveland, OH), pp. 133-140, Institute of Electrical and Electronics Engineers (IEEE), Aug 2016.
The definitive version is available at https://doi.org/10.1109/ISFA.2016.7790149
2016 International Symposium on Flexible Automation, ISFA2016 (2016: Aug. 1-3, Cleveland, OH)
Mechanical and Aerospace Engineering
Intelligent Systems Center
Keywords and Phrases
Abrasives; Frequency domain analysis; Sawing; Silicon carbide; Silicon wafers; Wire; Experimental and numerical studies; Frequency domains; Silicon carbide wafers; Tension controls; Vibration characteristics; Vibration frequency; Vibration model; Wire vibrations; Vibration analysis
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Aug 2016