Experimental and Numerical Studies of Wire Vibrations in Bonded Abrasive Wire Saw Processing


Bonded Abrasive Wire (BAW) saw slicing is a popular method for silicon carbide wafer production; however, the wires are highly susceptible to vibrations. In this paper, a vibration model of the wire saw is presented, and a numerical analysis of this model, which is confirmed by experiments, is developed. The experiments show that the model can predict vibration characteristics of wire saw with no processing or processing and the biggest error of model in frequency domain is 10.6%. Moreover, the wire tension is an important factor for wire saw vibration. The experiments show that a 50% increase in tension may make a 43.2% increase in vibration frequency, and the relationship is not linear depended on tension control device.

Meeting Name

2016 International Symposium on Flexible Automation, ISFA2016 (2016: Aug. 1-3, Cleveland, OH)


Mechanical and Aerospace Engineering

Research Center/Lab(s)

Intelligent Systems Center


The authors wish to acknowledge the financial support for this work from the National Natural Science Foundation of China (51105303, 51175420, and 51575442), the Shaanxi Province Education Department (00S1409), and China Postdoctoral Science Foundation funded project (20110491673), and the Intelligent Systems Center at the Missouri University of Science and Technology.

Keywords and Phrases

Abrasives; Frequency domain analysis; Sawing; Silicon carbide; Silicon wafers; Wire; Experimental and numerical studies; Frequency domains; Silicon carbide wafers; Tension controls; Vibration characteristics; Vibration frequency; Vibration model; Wire vibrations; Vibration analysis

International Standard Book Number (ISBN)


Document Type

Article - Conference proceedings

Document Version


File Type





© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2016