Solder droplet printing technology, which is low-cost, noncontact, flexible, data-driven, and environmentally friendly, has emerged as an enabling technology for precisely placing fine solder deposits on a variety of small substrates. It is suitable for a variety of applications including direct chip attach site preparation, 3D substrates, fine line interconnect, substrate via fill, optoelectronics and many others. It enables manufacturing techniques that are impossible or unfeasible with current technology, such as localized replacement of solder on board, depositing solder in different thicknesses on the same board, or using more than one type of solder on the same board. This makes the evaluation of solder droplet printing technology essential for the microelectronics industry. In this paper, the principle of the solder droplet printing technology is described, recent experimental results are included, and potential applications of the technology in the microelectronics industry are evaluated.


Mechanical and Aerospace Engineering

Keywords and Phrases

3D Substrates; Data-Driven Process; Direct Chip Attach Site Preparation; Drops; Environmentally Friendly Process; Fine Line Interconnects; Fine Solder Deposit Placement; Fine-Pitch Technology; Flexible Process; Flip-Chip Devices; Integrated Circuit Interconnections; Integrated Circuit Packaging; Integrated Circuit Testing; Localized Solder Replacement; Manufacturing Techniques; Microassembling; Microelectronics Industry; Multi-Type Solder Printing; Noncontact Process; Optoelectronics; Solder Deposition Thicknesses; Solder Droplet Printing Technology; Soldering; Substrate Via Fill

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2001 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jan 2001