Enhancement of Thermal Contact Conductance of Coated Junctions

Author

Kee-Chiang Chung
John W. Sheffield, Missouri University of Science and TechnologyFollow

Recommended Citation

K. Chung and J. W. Sheffield, "Enhancement of Thermal Contact Conductance of Coated Junctions," Journal of Thermophysics and Heat Transfer, American Institute of Aeronautics and Astronautics (AIAA), Jan 1995.

Department(s)

Mechanical and Aerospace Engineering

International Standard Serial Number (ISSN)

0887-8722

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 1995 American Institute of Aeronautics and Astronautics (AIAA), All rights reserved.

Publication Date

01 Jan 1995