The Effects of Selected Impurities on the Electrocrystallization of Zinc
Low levels of nickel, glue, and antimony, additions to acid sulfate electrolyte affect the corrosion of zinc during electrodeposition. Kinetic data and deposit morphology were obtained using cyclic voltammetric techniques in conjunction with scanning electron microscopy (SEM). The resulting data support a diffusion controlled codeposition from acid sulfate electrolyte of low levels of nickel with zinc. Local cell corrosion of zinc via the cathodic action of nickel sites is evidenced by severe pitting of the zinc crystallites. Glue is beneficial in offsetting the deleterious effects of nickel.
L. W. Blaser et al., "The Effects of Selected Impurities on the Electrocrystallization of Zinc," Electrochemical Society Extended Abstracts, The Electrochemical Society (ECS), Jan 1985.
Electrochemical Society Extended Abstracts (1985, Las Vegas, NV, USA)
Materials Science and Engineering
Article - Conference proceedings
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