Structure and Properties of Metallic Tin Films Deposited onto Heated Substrates in a Glow Discharge
The microstructures of thin metallic tin films prepared by plasma-enhanced metalorganic chemical vapor deposition (PE-MOCVD) were investigated. The structure and properties of the plasma-formed tin films are found to be strongly influenced by the substrate temperature. In this paper, emphasis is focused on the mechanisms of nucleation and growth related to the microstructure of the resulting films. It is found that the grain growth of films deposited at low temperatures (less than 120°C) is mainly by a non-diffusional process, whereas the diffusional processes are found to dominate in the grain growth of films deposited in the higher temperature range. Electrical sheet conductivities of films deposited at various temperatures were measured and correlated to the microstructures of the resulting films. © 1990.
T. J. Lin et al., "Structure and Properties of Metallic Tin Films Deposited onto Heated Substrates in a Glow Discharge," Materials Science and Engineering: B, Elsevier, Jan 1990.
The definitive version is available at https://doi.org/10.1016/0921-5107(90)90100-P
Materials Science and Engineering
International Standard Serial Number (ISSN)
Article - Journal
© 1990 Elsevier, All rights reserved.
01 Jan 1990