Titanium dioxide ceramics (TiO2) are candidate materials for high energy density pulsed power devices. Experiments to quantify the dielectric strength of TiO2 have been performed on a limited number of unoptimized samples. A high voltage test set was constructed to test the titanium dioxide. All samples had a relative dielectric constant of 100, all samples were of 3 mm nominal thickness, and all tests were performed in water dielectric to reduce the effect of the triple point field enhancement at the electrode edge. Both single layer and laminated samples were tested and the breakdown field strengths were recorded. Voltage risetimes varied slightly around 400 ns depending upon the size of the test sample area. Areas varied from < 0.2 cm^2 to > 100 cm^2. Both single layer and laminated material showed a strong area effect where the dielectric strength dropped off as area to the -0.17 and -0.1 power respectively. Effective areas of the electrodes were calculated using a field solver program. Breakdown field strengths varied from 469 kV/cm to 124 kV/cm in the single layer specimens, and from 556 kV/cm to 261 kV/cm in the laminates over an increasing area range. Energy density calculations for the material show that at areas of approximately 100 cm^2 the laminates can store nearly 3 times more energy than single layers.

Meeting Name

12th IEEE International Pulsed Power Conference, 1999


Materials Science and Engineering

Keywords and Phrases

3 Mm; 400 Ns; TiO2; Ceramics; Dielectric Strength Measurement; Electric Breakdown; Electric Strength; Electrode Edge; Field Solver Program; High Energy Density Pulsed Power Devices; High Voltage Test Set; High-Voltage Techniques; Laminated Material; Laminated Samples; Laminations; Materials Testing; Permittivity; Pulse Generators; Pulsed Power Supplies; Relative Dielectric Constant; Single Layer; Titanium Compounds; Titanium Dioxide Ceramics; Triple Point Field Enhancement; Unoptimized Samples; Voltage Measurement; Voltage Risetimes; Water Dielectric

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 1999 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jan 1999